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Industry Solution

Fabless & IDM

Samsung / TSMC 3nm GAA 공정 완벽 지원
글로벌 Top-tier 파운드리 및 팹리스를 위한 자율 설계 OS

SEC
TSMC

Foundry Ecosystem Ready

3nm/5nm PDK Integration Completed

99%
Signoff-Grade Correlation

기존 과제

  • 긴 설계 기간 (12-24개월)
  • 높은 인력 의존도
  • PPA 최적화 어려움
  • 검증 비용 증가
  • TTM 압박

CREAIM 솔루션

8x
설계 기간 단축
기존 대비 개발 속도
70%
인력 효율화
필요 인력 감소
90%
자동화율
설계 공정 자동화
95%
First-Pass Success
초기 성공률 향상

적용 분야

AI Accelerator (NPU/TPU)
Mobile SoC
IoT Processor
Automotive Controller
Custom ASIC

Ready for Mass Production

CREAIM은 이미 Samsung Foundry 및 TSMC 최신 공정에서 검증되었습니다.
지금 바로 귀사의 차세대 3nm 칩 설계에 도입하세요.

Enterprise Partnership 문의기술 준비도 보고서 확인